Localized thermometry via Dayem bridges integrated on superconducting qubit chips

Systems R&D

Here we demonstrate a complementary on-chip thermometry method based on superconducting Dayem bridges that are integrated on the same chip as transmon qubits. By extracting the critical current of the Dayem bridge from I-V measurements, we obtain a local, quantitative measure of the chip temperature without the need for microwave calibration or qubit-specific control sequences.

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